solder造句

1、There is no need to field solder or to struggle with a crimp pin.
无需焊接或外地奋斗的卷曲针。

2、Solder side is chosen to measure.
4量测以吃锡面为选择点。

3、solder together by using hard solder with a high melting point
用高熔点的焊料来连接。

4、Becareful not to overheat the solder and damage the diodes.
注意不要使烙铁过热而损坏二极管。

5、tinning the ends of the wires makes a better joint when you solder them
当你焊接接口时，用锡焊很管用。

6、And the different section shape of the solder joint is given with the variation of solder volume.
给出了不同的钎料量对应的焊点剖面形态的变化。

7、Will the sample needs of solder part in flux in 5 to 10 seconds.
将样品需要焊锡的部分浸入助焊剂中5到10秒。

8、An ideal connection that puts any solder to shame.
这种理想的连结方式，让其它各类接合方式瞠乎其后。

9、Tin-lead solder in the manufacture of professional audio equipment.
用于制造专业音响设备的铅锡焊料。

10、The Study on MCM′s Solder Joint Shape
MCM焊点形态研究方法探讨

11、Time of solder can be set.
焊锡时间可以根据不同要求设定。

12、When joint is filled, a continuous run of solder or brazing alloy will be visible.
在安装连接部件时，可以看到焊料和钎焊合金继续流动。

13、A solder paste used for brazing was developed and its technical performance was investigated.
研制了铝硬钎焊用钎料膏，对其工艺性能进行了研究。

14、Impact of Solder Pearl on SMC
锡珠对SMC电性能的影响

15、Heat up your soldering iron and tin it by allowing it to melt a drop of solder onto its tip.
加热你的电烙铁，通过允许其热量融化的一滴锡滴在它的尖端来锡化它。

16、The shear strength of BGA joint with eutectic solder is higher than that of tin-lead alloy itself.
共晶钎料BGA球焊点的抗剪强度比锡铅合金钎料自身的抗剪强度大。

17、Printed circuit board, Solder mask, Flood screen printing, Quality Control.
印制板，阻焊膜，丝网印刷，品质控制。

18、Finally the life of CSP solder joint based on Pb-free material 95.
基于三维有限元分析方法预测热循环条件下焊点的疲劳寿命，对无铅材料95。

19、The manufacture of solder bump is one of the key technologies for area array packaging.
钎料凸台和互连焊点的重熔是面阵封装的关键技术之一。

20、they forget to solder the contacts.
他们忘记了焊接切点。

21、Fewer workers are needed to solder circuit boards.
焊接电路板需要较少的工人。

22、This makes for the best solder job.
这是为了使焊接至臻完美。

23、Lead-free solder wire is one kind of environmental-friendly product with good stability.
无铅锡线是一种环保型，稳定性很好的产品。

24、So it will result in rigidity skin &block and solder balls etc.
产生的后果是：锡膏出现硬皮、硬块、难熔并产生大量锡球等。

25、The use of nitrogen will depend on the solder paste flux chemistry.
是否使用氮气取决于焊锡膏焊剂的化学特性。

26、PCBA conformal coating, dam process, Solder mask coating, DIP Component fixing.
PCBA表面三防涂覆、堤坝工艺、涂防焊胶、DIP元件加固等。

27、Carefully solder 2 new thin, flexible, insulated wires in place.
小心的将两条细、易弯曲并且绝缘的新导线焊接到位。

28、Therefore, it is necessary to study the reliability of this mixed solder joint.
因此，有必要对这种混合焊点进行可靠性分析。

29、Less residue, shinny and clean solder spot.
残留物少，焊点光泽，干净。

30、The Development of Test Instrument for Solder Paste Print Performance
焊膏印刷性能测试仪器的研制

solder翻译